Contact Mask Aligner
Suss Microtec MJB4
Manual mask alignment and exposure
Sample size: 1鈥 to 4鈥 wafer/substrate, thickness: up to 4 mm.
Mask Size 2鈥 x 2鈥 to 5鈥 x 5鈥. Mask thickness: up to 4.8 mm.
350 W Hg lamp source (i line exposures)
Constant intensity power supply
Hard contact, soft contact and vacuum contact print modes