Analytical instruments

Sample preparation lab

  • Isomet Precision Saw
  • Buehler Vacuum Chamber
  • Buehler Ecomet 6 Grinder/Polisher
  • NEY Ultrasonic Bath
  • Torramet Specimen Dryer
  • Wild M3C Stereo Microscope (6.5 to 40X)
  • Olympus SZ40 Stereo Microscope (13.3 to 80X)

 Prep Lab

Optical Microscopy Suite

  • Microscopic Lab
  • Wild M420 (maximum magnification 80X)
  • Nikon Optiphot (maximum magnification 1000X)
  • Wild M8 (maximum magnification 125X)
  • Unitron Versamet Metallograph (maximum magnification 1200X)
  • IMAGING
  • Nikon D2X Digital Camera
  • Spot Insight Camera
  • VIA-150 Video Image Marker Measurement System

Optical Microscopy 

Sonix HS500 HiSPEED Acoustic Microscope System

  • Non-destructive test uses ultra-sound to characterize samples
  • Used to find voids, cracks, delamination, die tilt, etc.
  • Scan at a specified depth to collect data at desired interfaces
  • Pulse-echo and through scan capabilities
  • Create 3-D images, vertical cross-section images
  • 10, 15, 50 and 110 MHz transducers available

 Sonix

Fein Focus Series FXS 100.23 Real-Time X-Ray Imaging System

  • Used for observing semiconductor bonds, bare board registration of inner layers, populated PWB solder joints, ceramic material flaws, etc.
  • Non-contact, non-destructive inspection
  • Integrated X-Y-Z manipulation system
  • Tilt and rotate control
  • Real-time video imaging
  • Magnification zoom of 2X up to 180X (depending on the thickness and orientation of the sample)
  • Maximum sample size 12"x15"
  • Voiding calculation & BGA inspection software

Fein Focus 

Coordinate Measuring Machine

Tabletop system in a bridge-type design with a removable granite support. M10 threaded, stainless steel inserts accommodate and secure moderately sized workpieces. Fully pneumatic, counterbalanced column enables infinite adjustability for varying probe weights with a built-in braking device.
​

  • Coordinate Measuring Machine
  • Maximum Part Weight: 500 lbs (227 kg)
  • Part Size Capability (X, Y, Z): 22 x 29.5 x 19 in
  • Operating temperature: 13 °C to 35 °C
  • Repeatability* 0.00016 in
  • Volumetric Accuracy* 0.0004 in
  • Linear Accuracy* 0.0002 in
  • Measuring Speed (Max): 30 in/sec *Per ASME B89

Coordinate Measuring Machine


Aetrium Model 6000 Bubble Leak Detector

  • Used to inspect for leaks in sealed components
  • Tank tray dimensions 10" x 4"
  • 1.5X Fresnel lens and 3.0X external lens
  • Temperature control within ±1 °C
  • Meets requirements for MIL SPEC 883C, 750C and 202F
 Aetrium Model 6000

Veeco System XR X-Ray Fluorescence Spectrometer

  • Benchtop XRF unit
  • Sample stage capacity of approximately 6"x6"
  • X-ray spot diameter of 50 µm up to 300 µm
  • Analysis of elements from Na to U
  • Internal database with K, L, and M fluorescence lines Sampling depth of several µm
  • Layer thickness evaluation capability

 Veeco

Dage Series 4000 and 4000+ Bond Testers

  • Perform die shear, ball shear, wirebond pull, cold bump pull testing
  • Features and capabilities:
  • Die shear cartridge to 100 kg
  • 5 kg tweezer cartridge for cold bump pull
  • 5 kg ball shear load cartridge
  • 100 g wire pull load cartridge
  • 50 kg push/pull load cell Heated stage
  • Data analysis and graphics software

 Dage Series 4000

Rheometer/Viscometer

  • Enables analysis of visco-elastic materials such as solder paste, epoxy underfills, and conductive adhesives Measured parameters: Viscosity, Complex Viscosity, Kinematic Viscosity, Storage Modulus, Loss Modulus, and Compliance
  • Operational modes: oscillation, creep, and flow
  • Automatic gap setting with 0.01 µm resolution
  • Temperature range Standard (Peltier): -5 to 99 °C Extended (induction heating): -100 to 400 °C
  • Maximum torque: 0.05 Nm (500 K dyne cm)

 RheoMeter

Ocean Optics Spectrum Analysis System

  • For optical characterization of light sources, including LEDs and junction laser
  • Components
    • USB4000 UV/VIS spectrometer with fiber optic coupling LED
    • variable current power source
    • Integrating sphere
  • Capabilities
    • Wavelength range: near IR through UV (850 nm to 200 nm) Optical resolution

Ocean Optics 

FLIR Model E60 Thermal Camera

  • For construction of thermal images; essentially a contour map of temperature
  • Mid IR (wavelengths of 7-14 m)
  • Capabilities
  • 7 Hz image capture
  • Still image and motion video
  • IR and optical imaging combined in either picture-in-picture mode or thermal fusion mode
  • Emissivity correction
  • Zoom of distant objects down to 2x magnification of close objects
  • 240x320 pixel resolution of thermal image Temperature range 20 – 650 C
  • Sensitivity < .05 C

FLIR

Analysis Tech 32-102 Event Detector

  • Used for reliability/life testing of electrical connectors. Also applicable to testing of passive interconnects such as surface mount solder joints and chip-to-carrier interconnect systems.
  • Analysis Tech 32-102 Event Detector
  • 32 channels with simultaneous monitoring
  • Channel test current settings 10, 20, 50, 100 ma
  • Channel current source tolerance (0-20 Ω load) +4%, -11% Threshold voltage tolerance (pulse duration) ± 5% (typical), ± 10% (maximum)
  • Selectable minimum event duration settings 0.1, 0.5, 1.0 µs Data collection via RS232C serial port
  • Compatible with HLV amplifiers to provide low level threshold resistance and low current test capabilities

 Analysis Tech Event Detector

HP 4194A Impedance/Gain-Phase Analyzer

  • Provides integration for measurement and analysis or go/no-go testing of components and circuits
  • Programmable with customized measurement, computation, and analysis functions
  • 11 impedance and 4 gain-phase measurement functions Frequency range 100 Hz to 40 MHz for impedance 10 Hz to 100 MHz for gain-phase
  • Output range (adjustable DC bias level of ±40 V) 10 mV to 1 Vrms for impedance -65 dBm to ±15 dBm for gain-phase

 impedance detector

SR560 Low-Noise Voltage Preamplifier

  • Use in applications for low-temperature measurements, optical detection, and audio engineering
  • AC or DC coupled, differential or single-ended inputs
  • 4 nV/√Hz input noise @ 1 kHz
  • 1 MHz bandwidth •CMRR 100 dB from DC to 1 kHz
  • Variable gain from 1 to 50,000
  • Selectable gain allocation
  • Gain stability 200 ppm/°C
  • Frequency response ±0.5 dB to 1 MHz, ±0.3 dB to 300 kHz (gains up to 1000)
  • Configurable signal filters (low-pass or high-pass)
  • Maximum output 10 Vpp into 50 Ω and 600 Ω

 SR560

SR-830 Dual-Phase DSP Lock-In Amplifier

  • Simultaneously displays both signal magnitude and signal phase
  • Frequency range 1 mHz to 102.4 kHz
  • Dynamic reserve >100 dB •Stability 5 ppm/°C
  • Phase resolution 0.01°
  • Time constants from 10 µs to 30 ks (6, 12, 18, and 24 dB/octave rolloff)
  • Auto-gain, -phase, -reserve and -offset
  • Synthesized reference source (25 ppm frequency accuracy; <-80 dBc distortion)
  • Harmonic detection (2F, 3F, ..., nF)
  • Standard GPIB and RS-232 interfaces

 SR830

Interconnect Parameter Analyzer and Time Domain Reflectometer

  • Measures high-speed interconnects; extracts and verifies models by overlaying simulated and actual results
  • Direct readout of inductance, capacitance, and impedance vs. time
  • Fixtures to support various IC packages
  • Instrument performance: 35 ps rise time, fully differential, multi-channel TDR
  • Enhanced accuracy TDR impedance measurements for results to within 1.5%
  • Supports extraction of lumped, distributed, mixed, coupled, and lossy-line models

 Interconnect

HP 8720C Vector Network Analyzer

  • Simultaneous measurements of active device transmission and reflection characteristics
  • Scalar parameter measurements: Gain, Gain Flatness, Gain Compression, Reverse Isolation, Return Loss (SWR) and Gain Drift
  • Vector parameter measurements: Deviation from Linear Phase, Group Delay and Complex Impedance
  • Fast-sweep source with 1 Hz frequency resolution Frequency range 50 MHz up to 20 GHz
  • Power output +10 dBm
  • 20 dB range power sweep

 HP 8720C

WYKO NT 1100 Optical Profilometer

  • For applications in MEMS, thick films, optics, ceramics and other advanced materials
  • Utilizes white light interferometry
  • 3D surface measurements, from sub-nanometer roughness to millimeter- high steps
  • Vertical Measurement Range: 0.1nm to 1mm
  • Vertical Scan Speed up to 7.2μm/sec (288μin./sec)
  • Lateral Spatial Sampling 0.08 to 13.1μm
  • Field- of -View: 8.24mm to 0.05mm (larger areas with Data Stitching option)
  • Reflectivity: 1% to 100%

 WYKO  NT 1100